The two photon absorption (TPA) process is currently used to write high resolution microstructures that can be used in micro-electro-mechanical system (MEMS) and photonic crystal application. Key parameters required to predict the final structure formation for this process are experimentally determined and reported in this thesis for two commercially available resists, Ormocore and SU-8. Moreover, writing capability of 3D structures with simple features is demon-strated in this work. The TPA coefficients of resists were measured for 800 nm (wavelength) light. Light source with such wavelength, Ti: Sapphire femto-second laser, is mostly used for such application. The etch rate, another important parameter of a resist, is determined by varying the exposure dose and measuring the final thickness of the resist layer after different developing time. Mechanical stages with relatively high precision were used to scan the focused laser beam inside the resist in order to produce 3D structures. Rows and dots with different heights, square spirals and hanging beams were fabri-cated with different thickness by controlling the beam power and the scanning speed.
Product Identifiers
Publisher
Vdm Verlag Dr. Müller E.K.
ISBN-13
9783836483711
eBay Product ID (ePID)
17049022854
Product Key Features
Author
Zahidur Rahim Chowdhury
Publication Name
Sub-Micron Resolution 3d Structure Writing Using Tpa Process
Format
Paperback
Language
English
Subject
Engineering & Technology
Publication Year
2008
Type
Textbook
Number of Pages
140 Pages
Dimensions
Item Height
229mm
Item Width
152mm
Item Weight
195g
Additional Product Features
Title_Author
Zahidur Rahim Chowdhury
Country/Region of Manufacture
Germany
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