Chemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the semiconductor industry towards smaller, faster and less expensive interconnects. However, there are still many gaps in the fundamental understanding of the overall CMP process and the associated defect and contamination issues. This book brings together many of the active players in the field to focus on the interdisciplinary nature of these challenges. It reflects, to some extent, the role played by both academic institutions and multinational corporations in opening up the frontiers in the field of CMP for wider dissemination. Both experimental and theoretical contributions are included. Topics include: overview and oxide polishing; pads and related issues; metal polishing - W and Al; copper polishing and related issues; CMP modeling and fluid flow; and particle adhesion and post-polish cleaning.
Product Identifiers
Publisher
Materials Research Society
ISBN-13
9781558994737
eBay Product ID (ePID)
106498872
Product Key Features
Subject Area
Material Science, Mechanical Engineering
Author
M. Tsujimura, M. Krishnan, S. Danyluk, S. V. Babu
Publication Name
Chemical-Mechanical Polishing-Fundamentals and Challenges: Volume 566
Format
Hardcover
Language
English
Publication Year
2000
Type
Textbook
Number of Pages
281 Pages
Dimensions
Item Weight
591g
Additional Product Features
Series Title
Mrs Proceedings
Country/Region of Manufacture
United States
Editor
S. V. Babu, S. Danyluk, M. Tsujimura, M. Krishnan
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